Product laser
Products
Selective, non-contact laser transfer
DR Laser proprietary coaxial vision platform
Automatic gap adjustment
High precision and repeatability
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Specification |
Details |
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Transfer Method |
Mask (bulk) or Selective (Single), Non-Contact Die Transfer |
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Laser Source |
Excimer Laser / DPSS Laser |
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Transfer Rate |
Excimer Laser : 100 Hz DPSS Laser: 1k – 2k Hz* (nominal rate, depends on selectivity and pitch) |
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Laser Energy Control |
Programmable pulse energy for selective and uniform transfer |
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Process Area |
Configurable |
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Placement Accuracy |
±1.5 μm @ 3 σ |
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Donor Size Support |
Support 4” or 6” wafer |
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Substrate Size Support |
Support up to G2.5 |
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Vision System |
Coaxial Real-Time Alignment Platform (DR Laser Exclusive Design) |
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Alignment Accuracy* |
±0.2 μm @ 3 σ |
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Gap Adjustment |
≤ ±1 μm, automatic, real-time donor-receiver gap control |
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Automation Features |
Full automated alignment, gap adjustment, and transfer processing |
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Production Scalability |
Optimized for both R&D and mass production environments |
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*Carrier to substrate alignment, by high contrast chrome mask pattern |
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