Product laser
Products
Enables ultra-narrow line widths with 20%–50% paste savings
Adjustable aspect ratio from 10% to 80%, minimizing shading loss and boosting light-to-electricity conversion efficiency
High print consistency enhances electrical conductivity; compatible with low-temperature pastes
Non-contact, pressure-free printing significantly reduces breakage rate
Compatible with customized line patterns to maximize light reflection in lamination and increase module output
Supports a wide variety of advanced solar cell architectures
Designed for high-volume manufacturing with scalable output
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Specification |
Details |
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Compatible Wafer Sizes |
Full, rectangular, or half-cut wafers (182 to 210 mm) |
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Compatible Wafer Thickness |
100 to 180 μm |
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System Throughput |
≥14,400 pcs/hour |
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Grid Line Width |
10 to 15 μm |
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Grid Line Height |
5 to 15 μm |
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Aspect Ratio |
≥0.6 |
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Production Mode |
Supports both offline and inline operation, compatible with printing line integration |
